1070 aluminum plate for PS/CTP board base

1. 1070 aluminum plate for PS/CTP board base information
2. Advantages of 1070 aluminum plate for PS/CTP board base
3. 1070 PS/CTP aluminum substrate specifications
4. 1070 aluminum plate for PS/CTP board base cases

1070 PS/CTP aluminum substrate is a commonly used aluminum substrate material in the printed circuit board (PCB) manufacturing process.

1070 aluminum plate for PS/CTP board base information

• 1070 Aluminum Plate: 1070 is a grade of aluminum alloy commonly used in the manufacture of various aluminum-based materials, including printed circuit boards. This aluminum alloy has a higher purity, which is beneficial for thermal conductivity in PCB manufacturing.
• PS/CTP board: PS refers to Printed Circuit Board, and CTP is the abbreviation of Computer-to-Plate. Therefore, PS/CTP board is a substrate used in printed circuit board manufacturing, usually an aluminum substrate.

Advantages of 1070 aluminum plate for PS/CTP board base

Aluminum substrates have better heat dissipation properties than traditional glass fiber reinforced plastic substrates. In high-power electronic equipment, heat dissipation is very important, so aluminum substrates are often chosen.

The high purity of 1070 aluminum plate helps improve thermal conductivity, which is critical when heat dissipation is required in electronic equipment.

1070 PS/CTP aluminum substrate plays a role in providing support and heat dissipation in printed circuit board manufacturing.

1070 PS/CTP aluminum substrate specifications

The specifications of 1070 PS/CTP aluminum substrates can vary depending on the specific manufacturer and product design, but usually include the following common specifications:

• Sheet Thickness: Typical thicknesses may range from tens to hundreds of microns, depending on the requirements of the application and the manufacturing process.
• Aluminum Alloy Grades: The most common is 1070 aluminum alloy, but other aluminum alloys may be used depending on the design and application needs.
• Thermal conductivity: 1070 aluminum alloy generally has good thermal conductivity due to its high purity, which is crucial for heat dissipation in electronic equipment.
• Dimensions: Includes length, width and shape. Dimensions will vary based on specific application and manufacturing requirements.
• Surface Treatment: Includes anti-corrosion treatments, anodizing or other special surface coatings to improve corrosion resistance or appearance.
• Flatness: Indicates the flatness of the surface of the aluminum substrate, which is very important for the manufacturing of printed circuit boards.
• Workability: Aluminum substrates should have adequate workability to facilitate drilling, cutting and other processing steps.
• Electrical Properties: For printed circuit boards, electrical properties are key factors, including resistivity, dielectric constant, etc.

To obtain accurate specifications, you can directly send an email to: info@alu-sheet-coil.com, because different manufacturers may provide different specifications of 1070 PS/CTP aluminum substrates.

1070 aluminum plate for PS/CTP board base cases

1070 aluminum substrate is usually used in high-power electronic equipment, such as LED lighting, power modules, etc.

1070 aluminum plate for PS/CTP board base is widely used in the field of printed circuit board (PCB) manufacturing. Below is a list of some application examples, including Temper and specifications using 1070 aluminum alloy:

1070 aluminum plate for power module

• Temper: A typical Temper might be O (soft).
• Specifications: Thickness typically ranges from 50-200 microns, size varies based on power module design needs.

1070 aluminum plate for LED lighting

• Temper: O or H (hard) are possible, depending on heat dissipation requirements.
• Specifications: Thickness may vary depending on the power of the LED fixture, common specifications include 100-300 microns.

1070 aluminum plate for automotive electronic modules

• Temper: Usually O to ensure the bending performance of the plate.
• Specifications: Thickness may be between 50-150 microns, adapting to the size and heat dissipation needs of automotive electronic modules.

1070 aluminum plate for communication equipment

• Temper: May be O or H, depending on the thermal and structural requirements of the device.
• Specifications: Thickness and dimensions will vary depending on the type and power consumption of the communications device.

These are general examples and actual application temperatures and specifications will vary based on specific design and manufacturing requirements. For specific projects, it is recommended to contact the aluminum substrate supplier or manufacturer directly to obtain the exact specifications of the 1070 PS/CTP aluminum substrate that meets the requirements.